Arizona State University (ASU) has been officially designated as the site for the National Semiconductor Technology Center (NSTC) Prototyping and the National Advanced Packaging Manufacturing Pilot (NAPMP) Advanced Packaging Facility, marking a significant milestone under the CHIPS for America program. This announcement was made on January 6, 2025, and the facility is expected to become operational by the fourth quarter of 2028. The NSTC Prototyping facility will be co-located with MacroTechnology Works at ASU's Research Park in Tempe, Arizona [87c7fd1f].
U.S. Secretary of Commerce Gina Raimondo highlighted the critical importance of establishing a robust research and development ecosystem for national security, emphasizing that this facility will address challenges in scaling semiconductor technologies and will include advanced packaging capabilities [87c7fd1f]. ASU President Michael Crow noted that this facility is the largest of the three flagship CHIPS R&D facilities, which will significantly bolster the U.S. semiconductor ecosystem and create hundreds of jobs while attracting billions in investment [87c7fd1f].
The initiative has garnered strong support from local and federal officials, including Arizona Governor Katie Hobbs and U.S. Senator Mark Kelly, who both recognize its potential to solidify Arizona's position as a global leader in advanced manufacturing. The facility aligns with the broader goals of the CHIPS and Science Act, which aims to enhance semiconductor manufacturing and innovation within the United States [87c7fd1f].
Deirdre Hanford, CEO of Natcast, stated that the facility will foster collaboration among industry, academia, and startups, further enhancing innovation in the semiconductor sector [87c7fd1f]. Since 2020, Arizona has seen over 40 semiconductor expansions, resulting in approximately 16,000 jobs and an investment of $102 billion in the state, underscoring the growing importance of the semiconductor industry in Arizona's economy [9df8e695].