[Tree] UAE's AI partnership with the US and tech strategy

Version 0.31 (2024-09-30 07:34:37.860000)

updates: UAE shifts from Chinese investments to US tech partnerships

Version 0.3 (2024-09-29 15:55:35.665000)

updates: UAE and Saudi Arabia's investment plans in technology sectors

Version 0.29 (2024-09-29 08:42:23.427000)

updates: China's computing power increased by 25% in 2024

Version 0.28 (2024-08-20 01:40:59.408000)

updates: Hong Kong's AI goals and funding initiatives added.

Version 0.27 (2024-06-26 20:00:59.333000)

updates: Israel's plan to build a supercomputer for AI capabilities

Version 0.26 (2024-06-26 19:56:56.295000)

updates: Israel's plan to build a supercomputer for AI

Version 0.25 (2024-06-25 08:57:51.098000)

updates: The Beijing node of China Mobile computing center in Beijing has been officially put into operation.

Version 0.24 (2024-05-13 16:56:45.602000)

updates: The Isambard-AI supercomputer in the UK has come online as the country's fastest and most powerful supercomputer. The U.K. has also joined the EU's EuroHPC program.

Version 0.23 (2024-05-09 03:35:00.591000)

updates: Samsung uses AI to design its first 3nm mobile processor

Version 0.23 (2024-05-09 03:35:00.591000)

updates: Samsung uses AI to design its first 3nm mobile processor

Version 0.23 (2024-05-09 03:35:00.591000)

updates: Samsung uses AI to design its first 3nm mobile processor

Version 0.23 (2024-05-09 03:35:00.591000)

updates: Samsung uses AI to design its first 3nm mobile processor

Version 0.23 (2024-05-09 03:35:00.591000)

updates: Samsung uses AI to design its first 3nm mobile processor

Version 0.22 (2024-05-04 16:35:30.842000)

updates: Samsung uses AI to design its first 3nm mobile processor

Version 0.22 (2024-05-04 16:35:30.842000)

updates: Samsung uses AI to design its first 3nm mobile processor

Version 0.21 (2024-04-27 01:57:53.446000)

updates: TSMC introduces CoW-SoW technology for 3D stacking of wafer-sized processors

Version 0.2 (2024-04-26 03:46:16.710000)

updates: South Korea's initiative to commercialize brain-inspired AI semiconductors

Version 0.19 (2024-04-24 10:48:55.784000)

updates: Introduction of Ambiq Apollo510 MCU for AI wearables

Version 0.18 (2024-04-09 06:56:49.250000)

updates: Alif Semiconductor announces the launch of the Balletto family, the world's first BLE microcontroller with a neural co-processor for AI/ML workloads

Version 0.17 (2024-04-09 06:51:32.315000)

updates: Collaboration between Think Silicon and Edge Impulse

Version 0.16 (2024-04-08 09:59:46.261000)

updates: Synaptics launches Astra platform with AI-native IoT processors

Version 0.15 (2024-04-02 20:48:19.740000)

updates: NexAIoT to showcase NISE 3910 at Embedded World 2024

Version 0.14 (2024-04-02 13:23:30.191000)

updates: GSI Technology launches high-capacity servers

Version 0.13 (2024-03-26 20:58:36.038000)

updates: Add information about Lattice Automate winning the BIG AI Excellence Award

Version 0.12 (2024-03-15 13:39:19.061000)

updates: Introduction of Cerebras' Wafer Scale Engine 3 chip for AI supercomputers

Version 0.11 (2024-03-15 13:22:11.672000)

updates: New information about Cerebras's WSE-3 AI chip and CS-3 supercomputer

Version 0.1 (2024-03-14 09:33:33.942000)

updates: Arm unveils Automotive Enhanced processors for AI-enabled vehicle development

Version 0.09 (2024-03-13 19:21:44.444000)

updates: Inclusion of Cerebras Systems' announcement of their new AI processor

Version 0.08 (2024-03-09 20:19:53.130000)

updates: Integration of Princeton University's AI chip breakthrough

Version 0.07 (2024-03-07 21:41:44.322000)

updates: Collaboration with EnCharge AI and Princeton University to advance low-power circuitry for GenAI inference

Version 0.06 (2024-03-07 08:58:55.339000)

updates: Collaboration between Infineon, Archetype AI, and Renesas to enhance AI sensor solutions and processor technology

Version 0.05 (2024-02-26 07:49:49.121000)

updates: Collaboration between Infineon, Archetype AI, and Renesas to enhance AI sensor solutions and processor technology

Version 0.04 (2024-02-22 02:27:43.883000)

updates: Collaboration between Infineon, Archetype AI, and Renesas

Version 0.03 (2023-10-26 11:57:14.370000)

updates: Restructured and streamlined information for clarity and coherence

Version 0.02 (2023-10-25 14:50:22.256000)

updates: Restructured and streamlined information for clarity and coherence

Version 0.01 (2023-10-19 10:26:14.289000)

updates: The new narrative provides a comprehensive overview of the AI Platform Alliance, its goals, and the importance of collaboration and transparency in the AI field.

Version 0.0 (2023-10-16 15:38:03.360000)

updates: