[Tree] Saudi Arabia's AI collaboration policies with China and the US
Version 0.34 (2024-10-15 04:54:31.818000)
updates: Saudi Arabia limits China AI ties; UAE strengthens US partnership
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Version 0.33 (2024-10-14 12:46:15.653000)
updates: UAE ranks second in AI talent globally; Gitex 2024 updates
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Version 0.32 (2024-10-06 17:49:05.003000)
updates: Added semiconductor plant discussions with Samsung and TSMC
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Version 0.31 (2024-09-30 07:34:37.860000)
updates: UAE shifts from Chinese investments to US tech partnerships
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Version 0.3 (2024-09-29 15:55:35.665000)
updates: UAE and Saudi Arabia's investment plans in technology sectors
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Version 0.29 (2024-09-29 08:42:23.427000)
updates: China's computing power increased by 25% in 2024
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Version 0.28 (2024-08-20 01:40:59.408000)
updates: Hong Kong's AI goals and funding initiatives added.
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Version 0.27 (2024-06-26 20:00:59.333000)
updates: Israel's plan to build a supercomputer for AI capabilities
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Version 0.25 (2024-06-25 08:57:51.098000)
updates: The Beijing node of China Mobile computing center in Beijing has been officially put into operation.
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Version 0.24 (2024-05-13 16:56:45.602000)
updates: The Isambard-AI supercomputer in the UK has come online as the country's fastest and most powerful supercomputer. The U.K. has also joined the EU's EuroHPC program.
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Version 0.23 (2024-05-09 03:35:00.591000)
updates: Samsung uses AI to design its first 3nm mobile processor
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Version 0.23 (2024-05-09 03:35:00.591000)
updates: Samsung uses AI to design its first 3nm mobile processor
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Version 0.23 (2024-05-09 03:35:00.591000)
updates: Samsung uses AI to design its first 3nm mobile processor
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Version 0.23 (2024-05-09 03:35:00.591000)
updates: Samsung uses AI to design its first 3nm mobile processor
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Version 0.23 (2024-05-09 03:35:00.591000)
updates: Samsung uses AI to design its first 3nm mobile processor
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Version 0.22 (2024-05-04 16:35:30.842000)
updates: Samsung uses AI to design its first 3nm mobile processor
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Version 0.22 (2024-05-04 16:35:30.842000)
updates: Samsung uses AI to design its first 3nm mobile processor
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Version 0.21 (2024-04-27 01:57:53.446000)
updates: TSMC introduces CoW-SoW technology for 3D stacking of wafer-sized processors
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Version 0.2 (2024-04-26 03:46:16.710000)
updates: South Korea's initiative to commercialize brain-inspired AI semiconductors
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Version 0.19 (2024-04-24 10:48:55.784000)
updates: Introduction of Ambiq Apollo510 MCU for AI wearables
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Version 0.18 (2024-04-09 06:56:49.250000)
updates: Alif Semiconductor announces the launch of the Balletto family, the world's first BLE microcontroller with a neural co-processor for AI/ML workloads
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Version 0.17 (2024-04-09 06:51:32.315000)
updates: Collaboration between Think Silicon and Edge Impulse
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Version 0.16 (2024-04-08 09:59:46.261000)
updates: Synaptics launches Astra platform with AI-native IoT processors
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Version 0.15 (2024-04-02 20:48:19.740000)
updates: NexAIoT to showcase NISE 3910 at Embedded World 2024
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Version 0.14 (2024-04-02 13:23:30.191000)
updates: GSI Technology launches high-capacity servers
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Version 0.13 (2024-03-26 20:58:36.038000)
updates: Add information about Lattice Automate winning the BIG AI Excellence Award
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Version 0.12 (2024-03-15 13:39:19.061000)
updates: Introduction of Cerebras' Wafer Scale Engine 3 chip for AI supercomputers
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Version 0.11 (2024-03-15 13:22:11.672000)
updates: New information about Cerebras's WSE-3 AI chip and CS-3 supercomputer
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Version 0.1 (2024-03-14 09:33:33.942000)
updates: Arm unveils Automotive Enhanced processors for AI-enabled vehicle development
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Version 0.09 (2024-03-13 19:21:44.444000)
updates: Inclusion of Cerebras Systems' announcement of their new AI processor
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Version 0.08 (2024-03-09 20:19:53.130000)
updates: Integration of Princeton University's AI chip breakthrough
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Version 0.07 (2024-03-07 21:41:44.322000)
updates: Collaboration with EnCharge AI and Princeton University to advance low-power circuitry for GenAI inference
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Version 0.06 (2024-03-07 08:58:55.339000)
updates: Collaboration between Infineon, Archetype AI, and Renesas to enhance AI sensor solutions and processor technology
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Version 0.05 (2024-02-26 07:49:49.121000)
updates: Collaboration between Infineon, Archetype AI, and Renesas to enhance AI sensor solutions and processor technology
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Version 0.04 (2024-02-22 02:27:43.883000)
updates: Collaboration between Infineon, Archetype AI, and Renesas
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Version 0.03 (2023-10-26 11:57:14.370000)
updates: Restructured and streamlined information for clarity and coherence
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Version 0.02 (2023-10-25 14:50:22.256000)
updates: Restructured and streamlined information for clarity and coherence
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Version 0.01 (2023-10-19 10:26:14.289000)
updates: The new narrative provides a comprehensive overview of the AI Platform Alliance, its goals, and the importance of collaboration and transparency in the AI field.
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